①SMT surface mount processing is equipped with 4 high-precision fully automatic surface mount processing production lines; Configure more flexible and adaptable responses to small and medium-sized orders;
② Support simultaneous production of single product>350 types of materials, with SMT surface mount production capacity of 5 million solder joints per day;
③The model of the line equipment is unified, and the program can be directly switched from sampling to mass production, reducing multiple manual programming operations and facilitating rapid production;
④4 lines are uniformly configured with SPI (3D solder paste testing instrument) to ensure that the SMT surface mount processing technology solder paste coating meets industrial standards;
⑤The solder paste adopts a 3.0 silver content lead-free ROHS imported brand;

①Match the first piece tester with the BOM list, automatically determine and record the device parameters of each switch and newly produced product, ensuring 100% correctness of the surface mount；
②10 temperature zone reflow soldering+channel furnace temperature tester, wirelessly transmitting real-time data through the furnace temperature tester to draw the actual welding furnace temperature curve, ensuring real-time welding temperature during PCBA processing and welding process, and ensuring PCBA welding reliability；
③AOI optical inspection instrument, 100% inspection of every solder joint on PCBA, eliminating defects such as errors, omissions, reversals, shorts, fakes, standing, and empty soldering；
④X-ray is used for solder joint perspective inspection of packaging devices such as BGA QFN that cannot be directly observed；