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The quality of SMT surface mount processing is a symbol of a company's technical and management level

2022-04-20

In today's increasingly fierce competition in electronic products, improving the quality of SMT surface mount processing has become one of the most critical factors. The quality level of SMT surface mount processing is not only a symbol of a company's skills and management level, but also closely related to the company's livelihood and development. We have developed a related quality control system based on the actual production situation of the company. 1. Adopting the production policy of "zero defects" and setting up SMT patches
How to print solder paste well

2022-03-09

With the rapid development of component packaging, more and more PBGA, CBGA, CCGA, QFN, 0201, 01005 resistive capacitive components have been widely used, and surface mount technology has also developed rapidly. In its production process, the influence and role of solder paste printing on the entire production process are increasingly valued by engineers. Okay, okay
How to improve the efficiency of SMT equipment?

2021-12-06

Improvement of SMT efficiency in terms of equipment: 1. Equipment itself: 1. Regularly inspect the parts of the equipment that are prone to problems, and strive to solve them before faults occur. Develop accessory management requirements and keep inventory of vulnerable accessories to prevent unnecessary parts from affecting production in case of problems. 2: Train operators to promptly troubleshoot equipment failures and reduce downtime
BGA IC soldering process principle

2021-11-30

（1） The scientific process of chip surface mounting and soldering technology improves the success rate of BGA disassembly and soldering. 1. Firstly, it is necessary to preheat the BGA IC, especially for large-area plastic packaging BGA IC, to avoid sudden high temperatures that can cause damage due to thermal expansion and deformation of the PCB board. The preheating method is generally to raise the hot air nozzle, pull it apart from the IC, evenly blow the IC, and control the time
BGA、TAB、 Parts, packaging, and bonding processes

2021-10-13

Active parts (Devices) refer to various active integrated circuits or transistors in the semiconductor industry, as well as passive parts such as resistors and capacitors. 2. Array arrangement refers to the hole positions of through holes or surface mounted solder pads, which land on the board in a grid intersection pattern
Corresponding table for BGA repair disassembly and soldering program selection

2021-09-17

Selection table for BGA disassembly program - Lead BGA size Single board thickness 15 × 15+/-5mm25 × 25+/-4mm33 × 33+/-3 mm42 × 42+/-5 mm1.6MM+/-10% R-1.6mm-15 × 15R-1.6mm-25 × 25R-1.6mm-33 × 33R-1.6m
Shanghai Qianglin Electronic Technology Co., Ltd. SMT common defects sharing

2021-08-23

Shanghai Qianglin Electronic Technology Co., Ltd. SMT Common Defective Sharing A Solder Beads 1. Before printing, the solder paste was not fully warmed, thawed, and stirred evenly. 2. After printing for too long without reflux, the solvent evaporates and the paste turns into dry powder before falling onto the ink. 3. Printing is too thick, causing excess solder paste to overflow after the component is pressed down. When REFLOW, the temperature rises too quickly (SLOPE>3), causing boiling. five
Introduction to Naming Rules for PCB Component Libraries

2021-07-14

1. Integrated circuits (direct insertion) are represented by DIP pin count+suffix. There are two types of suffix for dual in-line packaging, N and W, which are used to indicate the device's body width. N is the narrow package, with a body width of 300mil and a pin spacing of 2.54mmW, with a body width of 600mil and a pin spacing of 2.54mm. For example, DIP-16N represents a body width of 300mil

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