Introduction to Naming Rules for PCB Component Libraries

1. Integrated Circuit (Direct Insertion)

Use DIP pin count+suffix to represent dual in-line package

There are two types of suffixes, N and W, used to represent the body width of the device

N is a narrow package with a body width of 300mil and a pin spacing of 2.54mm

W is a package with a body width of 600mil and a pin spacing of 2.54mm

For example, DIP-16N represents a 16 pin narrow body dual in-line package with a body width of 300mil and a pin spacing of 2.54mm

2. Integrated Circuit (SMT)

Use SO pin count+suffix to represent small form factor surface mount packaging

There are three types of suffixes, N, M, and W, used to represent the body width of the device

N is a narrow package with a body width of 150mil and a pin spacing of 1.27mm

M is a package between N and W, with a body width of 208mil and a pin spacing of 1.27mm

W is a package with a body width of 300mil and a pin spacing of 1.27mm

For example, SO-16N represents a 16 pin small form factor surface mount package with a body width of 150mil and a pin spacing of 1.27mm

If SO is in front of M, it represents a micro package with a body width of 118mil and a pin spacing of 0.65mm

3. Resistance

3.1 The naming method for SMD surface mount resistors is: package+R

For example, 1812R represents a resistor package with a size of 1812

3.2 The naming method for carbon film resistors is: R-package

For example, R-AXIAL0.6 represents a resistor package with a pad spacing of 0.6 inches

3.3 The naming method for cement resistors is: R-type

For example, R-SQP5W represents a cement resistor package with a power of 5W

4. Capacitor

4.1 The naming method for non-polar capacitors and tantalum capacitors is: packaging+C

For example, 6032C represents a capacitor package packaged as 6032

4.2 The naming method for SMT monolithic capacitors is RAD+pin spacing

For example, RAD0.2 represents an SMT monolithic capacitor package with a pin spacing of 200mil

4.3 The naming method for electrolytic capacitors is: RB+pin spacing/outer diameter

For example, RB. 2/. 4 represents an electrolytic capacitor package with a pin spacing of 200mil and an outer diameter of 400mil

5. Diode rectifier device

The naming method is based on the actual packaging of the components, where BAT54 and 1N4148 are packaged as 1N4148

6. Transistor

The naming method is based on the actual packaging of the components. The SOT-23Q package adds Q to distinguish it from the SOT-23 package of the integrated circuit. In addition, several field-effect transistors use the component name as the package name to call the component without errors

7. Crystal oscillator

HC-49S, HC-49U are surface mount packages, AT26, AT38 are cylindrical packages, and the specifications and dimensions of the digital watch are

For example, AT26 represents a cylindrical package with an outer diameter of 2mm and a length of 8mm

8. Inductance and transformer components

Inductance packaging adopts TDK company packaging

9. Optoelectronic devices

9.1 The naming method for surface mount light-emitting diodes is represented by packaging+D

For example, 0805D represents a light-emitting diode packaged as 0805

9.2 Direct insertion LED is represented as LED - outer diameter

LED-5 represents a direct insertion light-emitting diode with an outer diameter of 5mm

9.3 Naming of Devices Used for Digital Tubes

10. Plug in

10.1 SIP+number of pins+pin spacing to represent a single row of pins, with two types of pin spacing: 2mm and 2.54mm

For example, SIP7-2.54 represents a 7-pin single row pin with a pin spacing of 2.54mm

10.2 DIP+number of pins+pin spacing to represent double row pins, with two types of pin spacing: 2mm and 2.54mm

For example, DIP10-2.54 represents a 10 pin double row pin with a pin spacing of 2.54mm