The quality of SMT surface mount processing is a symbol of a company's technical and management level

In today's increasingly fierce competition in electronic products, improving the quality of SMT surface mount processing has become one of the most critical factors. The quality level of SMT surface mount processing is not only a symbol of a company's skills and management level, but also closely related to the company's livelihood and development. We have developed a related quality control system based on the actual production situation of the company.

1.Taking "zero defects" as the production policy, set up SMT surface mount processing quality process control points.

2.Setting of Quality Process Control Points

Reaching "zero defect" production is an unrealistic task, but promoting the "zero defect" production policy throughout the factory can greatly improve the quality awareness of all employees and provide continuous motivation for timely and standardized handling of quality anomalies in production. In order to ensure the normal operation of SMT processing, it is necessary to strengthen the quality inspection of each process and monitor its operation status. Therefore, it is particularly important to establish quality control points after some critical processes, so as to timely detect quality issues in the previous process and correct them, and prevent unqualified products from entering the next process. The setting of quality control points is related to the production process flow. We set the following quality control points during the processing.

1) PCB incoming material inspection

a. Is the printed circuit board deformed; b. Whether the solder pad is oxidized; c、 Whether there are scratches on the surface of the printed board;

Viewing method: Visually inspect according to the testing specifications.

2) Solder paste printing view

a. Can printing be thorough; b. Whether there is a bridge; c. Can the thickness be uniform; d. Whether there is a collapsed edge; e. Is there any error in printing;

Viewing method: visually inspect according to the testing specifications or inspect with a magnifying glass.

3) Check before reflow soldering furnace after SMT

a. The installation orientation of components; b. Whether there are any missing pieces; c. Whether there are any errors; d. Whether there is displacement;

Viewing method: visually inspect according to the testing specifications or inspect with a magnifying glass.

4) Check after passing through the reflow soldering furnace

a. The welding condition of the components, including the presence of poor welding phenomena such as bridging, standing, misalignment, solder balls, and virtual soldering. The condition of the welding points

Viewing method: Visual inspection according to the testing specifications or inspection with a magnifying glass

5) Plugin View

a. Are there any missing parts; b. Whether there are any errors; e. The insertion and installation status of components;

Viewing method: Visually inspect according to the testing specifications.

All inspection points must be filled out with specific and realistic reports, constantly reflecting and improving factors that affect quality, until approaching the "zero defect" production policy.